RMK1005

0.05

10~1M

±1

±2

±5

-65~150

30

±100

±300

RMK1608

0.1

50

RMK2012

0.15

50

RMK3216

0.25

100

RMK3225

0.5

150

RMK5025

0.8

150

RMK6332

1

200

ask∆R≤±（_%R+0.01Ω）

Resistance temperature characteristics

±100×10^-6/K

±300×10^-6/K

25℃、-65℃、25℃、150℃

Temperature shock

0.5

0.5

-65℃~150℃，5 cycles

100 temperature shocks

0.5

0.5

-65℃~150℃，100 cycles

Power Handling

0.5

0.5

70℃，100h，1.225U_R（≤U_max）

Low temperature operation

0.25

0.5

-65℃，U_R（≤U_max），45min

short time overload

0.25

0.5

2.5U_R（≤2U_max），5s

High temperature exposure

0.5

1.0

150℃，100h

Resistance to Soldering Heat

0.25

0.25

235℃，30s，3次循环

Moisture resistance

0.5

0.5

65℃，RH：80%~100%

life

0.5

0.5

70℃，U_R（≤U_max），2000h

Identification of inefficiency level

0.5

0.5

70℃，U_R（≤U_max），10000h

impact

0.5

0.5

Peak 100g, back peak sawtooth 2.96m/s, pulse width 6ms, Y-direction, 3 times

random

0.5

0.5

Power spectral density 0.02g2/Hz, Y-direction，15min

Consistency indicators

Standard deviation<0.6%, -0.6%<average value<0.5%

Consistency of the same batch: calculate the standard deviation for each batch of sampling; Consistency of different batches: calculate the average value for each batch of sampling

Thermal vacuum release

Total mass loss<1.00%; Collected condensable volatile matter<0.10%

125℃，Vacuum degree<7 × 10-3Pa，24h

solderability

Solder covers 95% of the electrode area

245℃，5s

Solder installation firmness

No mechanical damage

thrust：1005 is 10N, 1608, 2012, and 3216 are 20N, and 3225, 5025, and 6332 are 30N; Time: 30s

DPA

Defects and abnormal situations without standard regulations

GJB 4027A-2006working item0103

RN1031

0.25

10~1M

±1%

±2%

±5%

100

±300

C型

RN1041

0.375

RN1051

0.5

RN1061

0.625

RN1071

0.75

RN1081

0.875

RN1091

1

RN1101

1.125

RN1111

1.25

ask∆R≤±（_%R+0.01Ω）

Resistance temperature characteristics

M：±300×10^-6/K

25℃、-65℃、25℃、125℃

Temperature shock

0.7

-65℃~125℃，5 cycles

Low temperature operation

0.5

-65℃，U_R（≤2U_max），45min

short time overload

0.5

2.5U_R（≤2U_max），5s

Terminal tensile strength

0.25

20N，30s

Resistance to Soldering Heat

0.25

260℃，10s

Moisture resistance

0.5

65℃，RH：80%~98%

impact

0.25

Peak 100g, back peak sawtooth 2.96m/s, pulse width 6ms, 3 times

life

2.0

2.0

70℃，U_R（≤U_max），2000h

25℃，U_R（≤U_max），1000h

High temperature exposure

1.0

125℃，100h

low temperature storage

0.5

-65℃，24h

Power aging

0.7

25℃，100h

insulation resistance

not less than10GΩ

Under normal air pressure, 100VDC

solderability

Tin immersion area ≥ 95%

235℃，5s

Dielectric Withstanding Voltage

No mechanical damage, flashover or breakdown, leakage current<1mA

200V，1min

Consistency indicators

Standard deviation<0.9%, -0.9%<mean value<0.8%

Consistency of the same batch: calculate the standard deviation for each batch of sampling; Consistency of different batches: calculate the average value for each batch of sampling

RMK1005

0.05

10~1M

±1%

±2%

±5%

-65~150

30

±100

±300

RMK1608

0.1

50

RMK2012

0.15

50

RMK3216

0.25

100

RMK3225

0.5

150

RMK5025

0.8

150

RMK6332

1

200

ask∆R≤±（_%R+0.01Ω）

Resistance temperature characteristics

±100×10^-6/K

±300×10^-6/K

25℃、-55℃、25℃、125℃

Temperature shock

0.5

0.5

-65℃~150℃，5 cycles

Low temperature operation

0.25

0.5

-65℃，U_R（≤U_max），45min

short time overload

0.25

0.5

2.5U_R（≤2U_max），5s

High temperature exposure

0.5

1.0

150℃，100h

Resistance to Soldering Heat

0.25

0.25

235℃，30s，3 cycles

Moisture resistance

0.5

0.5

25℃~65℃，RH：80%~100%，10 cycles

life

0.5

2.0

70℃，U_R（≤U_max），2000h

Identification of inefficiency level

2.0

2.0

70℃，U_R（≤U_max），10000h

solderability

Solder covers 95% of the electrode area

245℃，5s

Solder installation firmness

No mechanical damage

Thrust: 1005 is 10N, 1608, 2012, 3216 is 20N, 3225, 5025/5225, 6332 is 30N; Time: 30s

RMZ1005

0.05

30

-65~150

1.3

RMZ1608

0.1

30

1.8

RMZ2012

0.15

20

2.7

RMZ3216

0.25

25

3.2

RMZ3225

0.5

25

4.47

RMZ5025

0.8

25

5.7

RMZ6332

1

25

6.3

Temperature shock

No mechanical damage，R≤R_max

-65℃~150℃，5 cycles

Low temperature operation

No mechanical damage，∆R≤R_max

-65℃，I_R，45min

short-time overload

No flashover, combustion, and coking phenomena，R≤R_max

2.5I_R，5s

High temperature exposure

No mechanical damage，R≤R_max

150℃，100h

Resistance to Soldering Heat

No mechanical damage, detachment or corrosion of the metallized film layer，∆R≤R_max

245℃，60s

Moisture resistance

No electrical or mechanical damage，R≤R_max

65℃，RH：80%~100%

life

No mechanical damage，R≤R_max

70℃，I_R，2000h

solderability

Electrode area covered by solder95%

245℃，5s

Solder installation firmness

No mechanical damage

Thrust: 1005 is 7.5N, 1608 is 10N, 2012, 3216, 3225 is 20N, 5025, 6332 is 30N; Time: 30s

RN1081

0.5

10~1M

±1

±2

±5

100

±300

Gtype

RN1091

1

Ctype

RN1101

1.125

Ctype

RN1111

1.25

Ctype

要求∆R≤±（_%R+0.01Ω）

Resistance temperature characteristics

M：±300×10^-6/K

-55℃~125℃

Power aging

0.7

1.225U_R（≤U_max），100h

short-time overload

0.5

2.5U_R（≤2U_max），5s

High temperature exposure

1.0

125℃，100h

Resistance to Soldering Heat

0.25

260℃，10s

Moisture resistance

0.5

65℃，RH：80%~98%

life

2.0

2.0

70℃，U_R（≤U_max），1000h

25℃，U_R（≤U_max），1000h

Terminal tensile strength

0.25

Tensile test: 20N, 30s, 3 outgoing ends; Bending test: ≥ 15 °, 3 times, 3 leads

Low temperature operation

0.5

-65℃，2.5U_R（≤2U_max），45min

Low temperature storage

0.5

-65℃，24h

High-frequency vibration

0.25

10Hz~2000Hz，75mm/200m/s²，12h

impact

0.25

100g, post peak serration; 2.96m/s, pulse width: 6ms, 3 times

Temperature shock

0.7

-65℃~150℃，5 cycles

insulation resistance

≥10GΩ

Under normal atmospheric pressure,10V_DC

solderability

Tin immersion area 95%

235℃，5s

RM1005

0.05

1~22M

±1

±2

±5

-55~125

30

±100

±300

RM1608

0.1

50

RM2012

0.15

RM3216

0.25

100

RM3225

0.5

150

RM5025

0.8

RM6332

1

200

RM4225

1

1~10M

RM6308

2

RM3263

3

8.2~1M

ask∆R≤±（_%R+0.01Ω）

Resistance temperature characteristics

±100×10^-6/K

±300×10^-6/K

-55℃~125℃

Temperature shock

0.5

0.5

-55℃~125℃，5 cycles

Low temperature operation

0.5

0.5

-55℃，U_R（≤U_max），                                                                                   min

short-time overload

0.5

0.5

2.5U_R（≤2U_max），5s

High temperature exposure

1.0

1.0

150℃，100h

Resistance to Soldering Heat

0.5

0.5

235℃，30s，3cycles

Moisture resistance

1.0

1.0

65℃，RH：80%~100%，10cycles

life

2.0

2.0

70℃，U_R（≤U_max），2000h

Vulcanization test

1.0

1.0

105 ℃, wet heat distillation powder test (with saturated potassium nitrate), 1000h

Solder installation firmness

No mechanical damage

Thrust: 1005 is 10N, 1608, 2012, 3216, 3225 is 20N, 5025, 6332, 3263, 4225, 6308 is 30N; Time: 30s

CRN1005B2R

0.031

1~1M

±1

±2

±5

25

±100

±250

CRN1005B4R

CRN1005B8R

10~1M

CRN1608B2R

0.063

50

CRN1608B4R

1~1M

CRN1608B8R

10~1M

CRN1608C8R

25

CRN3216C8R

50

CRN3216B2R

0.25

100

CRN3216B4R

Resistance value changes with temperature

S：±100×10^-6/K；

U：±250×10^-6/K

-55℃~125℃

short time overload

∆R≤±（1.0%R+0.05Ω）

2.5U_R（≤2U_max），5s

Bond strength of end face coating

Bend 1mm,（5±1）s

Resistance to Soldering Heat

260℃，10s

Rapid temperature changes

-55℃~125℃，5cycles

Damp heat steady state

∆R≤±（5.0%R+0.1Ω）

40℃，RH（93±3）%，56d

70℃durability

70℃，U_R（≤U_max），1000h

Climatic sequence

125℃/16h，Cyclic damp heat24h，-55℃/2h，Cyclic damp heat5d，DC load1min

solderability

Tin immersion area ≥ 90%

Non aging，235℃，2s

normal

Power increase

normal

Power increase

RI1005

0.5

0.6

0.031

0.063

50

1Ω~10MΩ：

1、2、5

10Ω~1MΩ：0.1、0.25、0.5

±100

±200

±500

RI1608

0.8

1

0.063

0.1

50

RI2125

1

1.2

0.1

0.125

100

RI3216

1.6

2

0.125

0.25

200

RI3225

2

2.2

0.25

0.5

200

RI5025

2

2.4

0.5

1

200

RI6332

2

2.6

1

1.5

200

RI3263

-

3

-

200

8.2Ω~1MΩ：

1、2、5

±250

±500

RI4225

-

1

-

200

1Ω~10MΩ：

1、2、5

±100

±200

±500

RIG6308

-

2

-

200

10Ω~1MΩ：

1、2、5

Note: The maximum current indicator is only applicable to zero ohm products; The nominal resistance value and allowable deviation resistance temperature characteristics are only applicable to non zero ohmic products.

Conventional resistance value

Zero Ohms

Conventional resistance value

Zero Ohms

Resistance value changes with temperature

S：±100×10^-6/K；

Z：±200×10^-6/K；

U：±250×10^-6/K；

V：±100×10^-6/K

-

-55℃~125℃

-

Rapid temperature changes

∆R≤±（1%R+0.05Ω）

R_max≤50mΩ

-55℃~125℃，5 cycles

overload

∆R≤±（1%R+0.05Ω）

R_max≤50mΩ

2.5U_R（≤2U_max），5s

2.5I_R，5s

Resistance to Soldering Heat

∆R≤±（1%R+0.05Ω）

R_max≤50mΩ

260℃，10s

Bond strength of end face coating

∆R≤±（1%R+0.05Ω）

R_max≤50mΩ

bend1mm，（5±1）s

Damp heat steady state

∆R≤±（5%R+0.1Ω）

R_max≤50mΩ

40℃，RH（93±3）%，56d

Climatic sequence

∆R≤±（1%R+0.05Ω）

R_max≤50mΩ

125 ℃/16h, cyclic damp heat for 24h, -55 ℃/2h, cyclic damp heat for 5d, DC load for 1min

70℃durability

∆R≤±（5%R+0.1Ω）

R_max≤50mΩ

70℃，U_R（≤U_max），1000h

70℃，I_R，1000h

solderability

Electrode area covered by solder90%

Non aging，235℃，2s

RM1005

0.05

10~22M

±1

±2

±5

-55~125

30

±100

±300

RM1608

0.1

50

RM2012

0.15

RM3216

0.25

100

RM3225

0.5

150

RM5025

0.8

RM6332

1

200

RM4225

1

1~10M

RM6308

2

RM3263

3

8.2~1M

ask∆R≤±（_%R+0.01Ω）

Resistance temperature characteristics

±100×10^-6/K

±300×10^-6/K

-55℃~125℃

Temperature shock

0.5

0.5

-55℃~125℃，5 cycles

Low temperature operation

0.5

0.5

-55℃，U_R（≤U_max），                                                                                   min

short time overload

0.5

0.5

2.5U_R（≤2U_max），5s

High temperature exposure

1.0

1.0

150℃，100h

Resistance to Soldering Heat

0.5

0.5

235℃，30s，3 cycles

Moisture resistance

1.0

1.0

65℃，RH：80%~100%，10 cycles

life

2.0

2.0

70℃，U_R（≤U_max），2000h

solderability

Electrode area covered by solder≥95%

245℃，5s

Soldering installation firmness

No mechanical damage

Thrust: 1005 is 10N, 1608, 2012, 3216, 3225 is 20N, 5025, 6332, 3263, 4225, 6308 is 30N; Time: 30s

RM3216-1W

1

10~10M

±1

±2

±5

-55~125

100

±100

±300

RM3225-1WA

150

±100

±300

RM6363-6W

6

10~1000

±5

77.5

±300

ask∆R≤±（_%R+0.01Ω）

Resistance temperature characteristics

±100×10^-6/K

±300×10^-6/K

-55℃~125℃

Temperature shock

0.5

0.5

-55℃~125℃，5 cycles

Low temperature operation

0.5

0.5

-55℃，U_R（≤U_max），                                                                                   min

short time overload

0.5

0.5

2.5UR (≤ 2Umax), 5s (RM6363-6W is 5 times the rated power consumption, 5s)

High temperature exposure

1.0

1.0

150℃，100h

Resistance to Soldering Heat

0.5

0.5

235℃，30s，3 cycles

Moisture resistance

1.0

1.0

65℃，RH：80%~100%，10 cycles

life

2.0

2.0

70℃，U_R（≤U_max），2000h（RM6363-6W为1000h）

Note: The RM6363-6W power on test requires the use of a high thermal conductivity test plate or other devices to assist in heat dissipation, ensuring that the body temperature of the product is ≤ 160 ℃ during operation

Short term overload of RM3216-1W and RM3225-1WA requires the use of high thermal conductivity test plates (such as beryllium oxide ceramics) to assist in heat dissipation

RMK1005

0.05

30

50~50k

W：±0.05

±10

25~50k

B：±0.1、D：±0.5、F：±1

±25、±50

RMK1608

0.1

50

50~260k

W：±0.05

±10

10~260k

B：±0.1、D：±0.5、F：±1

±25、±50

RMK2012

0.15

50

50~300k

W：±0.05

±10

10~510k

B：±0.1、D：±0.5、F：±1

±25、±50

RMK3216

0.25

100

50~499k

W：±0.05

±10

10~1M

B：±0.1、D：±0.5、F：±1

±25、±50

RMK3225

0.5

150

50~499k

W：±0.05

±10

10~1M

B：±0.1、D：±0.5、F：±1

±25、±50

RMK5025

0.8

150

50~499k

W：±0.05

±10

10~3M

B：±0.1、D：±0.5、F：±1

±25、±50

RMK6332

1

200

50~499k

W：±0.05

±10

10~3M

B：±0.1、D：±0.5、F：±1

±25、±50

ask∆R≤±（_%R+0.01Ω）

Resistance temperature characteristics

±10×10^-6/K

±25×10^-6/K

±50×10^-6/K

-55℃~125℃

Temperature shock

0.1

0.1

0.1

-65℃~150℃，5 cycles

Low temperature operation

0.1

0.1

0.25

-65℃，U_R（≤U_max），45min

short time overload

0.1

0.1

0.1

2.5U_R（≤2U_max），5s

High temperature exposure

0.1

0.1

0.2

150℃，100h

Resistance to Soldering Heat

0.2

0.2

0.25

235℃，30s，3 cycles

Moisture resistance

0.2

0.2

0.4

65℃，RH：80%~100%

life

0.5

0.5

0.5

70℃，U_R（≤U_max），2000h

solderability

Electrode area covered by solder≥95%

245℃，5s

RMKH1005

0.032

10~1M

±0.1

±0.25

±0.5

-65~150

25

±100

±300

RMKH1608

0.063

40

RMKH2012

0.1

50

RMKH3216

0.25

100

RMKH3225

0.5

150

RMKH5025

0.8

150

RMKH6332

1

150

ask∆R≤±（_%R+0.01Ω）

Resistance temperature characteristics

±100×10^-6/K

±300×10^-6/K

-55℃~125℃

Temperature shock

0.5

0.5

-65℃~150℃，5 cycles

Low temperature operation

0.25

0.5

-65℃，U_R（≤U_max），                                                                                   min

short time overload

0.25

0.5

2.5U_R（≤2U_max），5s

High temperature exposure

0.5

1.0

150℃，100h

Resistance to Soldering Heat

0.25

0.25

235℃，30s，3次循环

Moisture resistance

0.5

0.5

65℃，RH：80%~100%

life

0.5

2

70℃，U_R（≤U_max），2000h

Solder installation firmness

No mechanical damage

Thrust: 1005 is 10N, 1608, 2012, 3216 is 20N, 3225, 5025, 6332 is 30N; Time: 30s

solderability

Electrode area covered by solder≥95%

245℃，5s