RI42

5

10k~1G

10kΩ≤R≤100MΩ：

±0.5、±1、±2、±5

100MΩ<R≤200MΩ：

±1、±2、±5

200MΩ<R≤500MΩ：

±2、±5

500MΩ<R≤1GΩ：

±5

8k

1k

±100

±200

10

15k

12

15k

15

20k

20

30k

RI42-1

5

15k

10

25k

RI42-2

12

20k

15

25k

overload

∆R≤±（0.5%R+0.05Ω）

2.5UR or 2Umax (whichever is smaller), (5 ± 0.5) s

Resistance to Soldering Heat

∆R≤±（1%R+0.1Ω）

（350±10）℃，（3.5±0.5）s

Rapid temperature changes

RI42-1: (-55~225) ℃, 5 cycles; RI42, RI42-2: (-55~200) ℃, 5 cycles

Damp heat steady state

∆R≤±（2%R+0.1Ω）

（40±2）℃，RH（90~95）%，56d

Climatic sequence

High temperature: RI42-1: 225 ℃, RI42, RI42-2: 200 ℃, 16h; Cyclic damp heat: 25 ℃~55 ℃, 24 hours; Low temperature: -55 ℃, 2 hours; Low pressure: 8.5Kpa, 15 ℃~35 ℃, 1h; Cyclic damp heat: 25 ℃~55 ℃, 24 hours

electrical endurance

∆R≤±（5%R+0.1Ω）

Room temperature, RI42-1:1.1UR or Umax (whichever is smaller), 1000h; RI42, RI42-2: 1.2UR or Umax (whichever is smaller), 1000h

Upper limit category temperature durability

∆R≤±（2%R+0.1Ω）

U=0，RI42-1：225℃，1000h；RI42、RI42-2：200℃，1000h

RI80-0.5W

1~1000

±2

±5

±10

-55~125

≤±500

7.5

RI80-1W

10

RI80-2W

7.5

RI80A-2W

7.5

RI80-5W

20

±1

10

Steady damp-heat

（40±2）℃，RH（90~95）%，96h

△R≤±5%R

temperature variation

-55℃~125℃，2 cycles

△R≤±2%R

Resistance temperature characteristics

-55℃，+20℃，125℃

TCR≤±500×10^-6/K

vibrate

（10～55）Hz，0.35mm，50m/s²，10min

No mechanical damage，△R≤±2%R

Terminal tensile strength

5N，5s

△R≤±2%R

durability

25℃±10℃，Continuously apply rated voltage or maximum working voltage (whichever is lower) for 96 hours

△R≤±5%R

RI81（RI81A）

0.25

100k~200M

100kΩ~100MΩ：

±1、±2、±5、±10

101MΩ~360MΩ：±2、±5、±10

>360MΩ：±5、±10

2k

500

±250

0.5

100k~360M

4k

700

RI81

1

100k~360M

7k

1k

2

100k~500M

7k

3

100k~500M

8k

withstanding voltage

No breakdown or arcing

V-block method, 60s ± 5s, applied voltage as shown in the table above

solderability

Good tin immersion should manifest as free flow of solder and wetting with leads

（235±5）℃，（2±0.5）s

overload

∆R≤±（0.5%R+0.05Ω）

2.5UR or 2Umax (whichever is smaller), 5s

Terminal tensile strength

Tensile force: 10N (0.25W, 0.5W), 20N (other), bending: 2 times, twisting: 180 °, 2 times

vibrate

(10-500) Hz, 0.75mm or 98m/s2 (whichever is smaller), 6h

Resistance to Soldering Heat

（350±10）℃，（3.5±0.5）s

Rapid temperature changes

（-55~155）℃，5次

Damp heat steady state

∆R≤±（2%R+0.1Ω）

（40±2）℃，RH（93±3）%，56d

Climatic sequence

High temperature: 155 ℃, 16h; Cyclic damp heat: 25 ℃~55 ℃, 24 hours; Low temperature: -55 ℃, 2 hours; Low pressure: 8.5Kpa, 15 ℃~35 ℃, 1h; Cyclic damp heat: 25 ℃~55 ℃, 24 hours

electrical endurance

Room temperature, 1.2UR or Umax (whichever is smaller), 240h

Upper limit category temperature durability

U=0，155℃，1000h

Flame retardancy

Leaving the flame for less than 10 seconds to burn

Flame method, 15 seconds, 5 times

Surge test

∆R≤±20%R

0.25W：R>10MΩ，U=5kV，0.5W：R>1MΩ，U=10kV，1~3W：R>100kΩ，U=10kV；Cycle: 5s, 50 times

RI83

300

600

±5、±10

—

±300

±500

RI83

5

47

±1

±2

±5

±10

20

±100

±200

±500

RI83

10

6.2

400

RI83

200

300

2k

RI83

250

50

2k

RI83

350

50

5k

RI83

500

50

10k

overload

∆R≤±（2%R+0.05Ω）

300W：U_DC=                                                                                   ，s；

其他：U_AC=，s

Rapid temperature changes

∆R≤±（1%R+0.05Ω）

（-55~125）℃，5 cycles

Damp heat steady state

∆R≤±（2%R+0.1Ω）

（40±2）℃，RH（90~95）%，96h

Climatic sequence

∆R≤±（5%R+0.1Ω）

High temperature: 125 ℃, 16h; Cyclic damp heat: 25 ℃~55 ℃, 24 hours; Low temperature: -55 ℃, 2 hours; Low pressure: 8.5Kpa, 15 ℃~35 ℃, 1h; Cyclic damp heat: 25 ℃~55 ℃, 24 hours

electrical endurance

300W：∆R≤±（5%R+0.1Ω）

other：∆R≤±（2%R+0.1Ω）

Room temperature, UR or Umax (whichever is smaller), 300W: 1000h; Other: 240h

Upper limit category temperature durability

∆R≤±（2%R+0.1Ω）

U=0，125℃，96h

RI83A

30

50~1G

50Ω~1MΩ：

±0.5、±1、±2、±5

1MΩ~100MΩ：

±1、±2、±5

100MΩ~500MΩ：

±2、±5

500MΩ~1GΩ：

±5

10

±100

±200

RI83A1

30

10

RI83A

50

15

RI83A

70

15

RI83A1

70

15

RI83A

100（60）

20

RI83A1

100（60）

20

RI83A

120

22

RI83A1

120

22

RI83A

150

25

RI83A1

150

25

RI83A

200（180）

30

RI83A1

200（180）

30

RI83A

300

40

RI83A1

300

40

overload

∆R≤±（2%R+0.05Ω）

2.5UR or Umax (whichever is smaller)，                                                                              s

Rapid temperature changes

∆R≤±（1%R+0.05Ω）

（-55~125）℃，5 cycles

Damp heat steady state

∆R≤±（2%R+0.1Ω）

（40±2）℃，RH（90~95）%，240h

Climatic sequence

High temperature: 125 ℃, 16h; Cyclic damp heat: 25 ℃~55 ℃, 24 hours; Low temperature: -55 ℃, 2 hours; Low pressure: 8.5Kpa, 15 ℃~35 ℃, 1h; Cyclic damp heat: 25 ℃~55 ℃, 24 hours

durability

(25 ± 5) ℃, UR or Umax (whichever is smaller)，240h

Upper limit category temperature durability

U=0，125℃，240h

RI83D-11

80

50M

±2

10k

1000：1

±200

RI83D-12

100

80M

30k

3000：1

RI83D-21

50

70M

10k

2500：1

RI83D-22

50

70M

10k

2500：1

overload

∆R≤±（2%R+0.05Ω）

2.5U_Ror2U_maxor30kV（Take the smaller one），                                                                                   s

Rapid temperature changes

∆R≤±（1%R+0.05Ω）

（-55~125）℃，5 cycles

Damp heat steady state

∆R≤±（2%R+0.05Ω）

（40±2）℃，RH（90~95）%，240h

electrical endurance

∆R≤±（5%R+0.1Ω）

Room temperature, UR or Umax (whichever is smaller), 1000h

Upper limit category temperature durability

∆R≤±（2%R+0.05Ω）

U=0，125℃，240h

RJ013-0.167W

25

250

1.5

-55~125

RJ014-0.25W

350

2.5

RJ015-0.5W

500

withstanding voltage

No breakdown or arcing

V-block method, 1 minute, applied voltage as shown in the table above

solderability

Good tin immersion should manifest as free flow of solder and wetting with leads

（235±5）℃，（2±0.5）s

Terminal tensile strength

∆R≤±2mΩ

Tensile force: 5N (RJ013)/10N (other), bending: 2 times, twisting: 180 °, 2 times

Resistance to Soldering Heat

（260±5）℃，（10±1）s

overload

2x maximum rated current, 5s

vibrate

(10-500) Hz, 0.75mm or 98m/s2 (whichever is smaller), 6h

Upper limit category temperature durability

∆R≤±5mΩ

U=0，125℃，1000h

70℃durability

（70±2）℃，Maximum rated current，1000h

Climatic sequence

high temperature：125℃，16h；Cyclic damp heat：25℃~55℃，24h；low temperature：-55℃，2h；Low pressure: 8.5Kpa, 15 ℃~35 ℃, 1h; Cyclic damp heat: 25 ℃~55 ℃, 24 hours

Damp heat steady state

（40±2）℃，RH（90~95）%，21d

RJ13

0.167

10~1M

±1

±2

±5

200

300

±100

RJ14

0.25

1~5.1M

250

350

±50

±100

RJ15

0.5

10~3.3M

350

500

±100

withstand voltage

No breakdown or flying arc

V-block method, 1min, the applied voltage is shown in the table above

solderability

Good tin immersion shall show the free flow of the solder and wetting with the lead

RJ 14: (245 ± 3) ℃, (3 ± 0.3) s; Others: (235 ± 5) ℃, (2 ± 0.5) s

The temperature changes rapidly

∆R≤±（0.5%R+0.05Ω ）

(-55~125) ℃, 5 cycles

overload

2.5U_ROr 2U_max(Small ones), 5s

Lead-end strength

Tension force: 5N (RJ 13) / 10N (other), bend: 2, twist: 180°, 2

Welding heat resistance

（260±5）℃，（10±1）s

The order of climate

∆R≤±（2%R+0.1Ω ）

High temperature: 125℃, 16h; circulating damp heat: 25℃ ~55℃, 24h; low temperature: -55℃, 2h; low pressure: 8.5 Kpa, 15℃ ~35℃, 1h; circulating damp heat: 25℃ ~55℃, 24h

70℃ durability

（70±2）℃，U_Rperhaps U_max(Small ones), 1000h

vibrate

∆R≤±（0.5%R+0.05Ω ）

(10~500) Hz, 0.75mm or 98m / s²(Small ones), 6h

Steady state damp heat

∆R≤±（2%R+0.1Ω ）

RJ13、RJ15：（40±2）℃，RH （90~95）%，56d ；RJ14：（40±2）℃，RH （93±3）%，56d

Upper limit class temperature durability

U=0，125℃，1000h

RJ14S

0.25

1~2M

±0.5

±1

±2

±5

200

250

±100

RJ15S

0.5

1~10M

250

350

RJ16S

1

1~10M

350

500

withstand voltage

No breakdown or flying arc

V-block method, 1min, the applied voltage is shown in the table above

solderability

Good tin immersion shall show the free flow of the solder and wetting with the lead

（235±5）℃，（2±0.5）s

The temperature changes rapidly

∆R≤±（0.5%R+0.05Ω ）

(-55~125) ℃, 5 cycles

overload

2.5U_ROr 2U_max(Small ones), 5s

Lead-end strength

Tension force: 5N (RJ14S) / 10N (other), bend: 2, twist: 180°, 2

Welding heat resistance

（260±5）℃，（10±1）s

The order of climate

∆R≤±（2%R+0.1Ω ）

High temperature: 125℃, 16h; circulating damp heat: 25℃ ~55℃, 24h; low temperature: -55℃, 2h; low pressure: 8.5 Kpa, 15℃ ~35℃, 1h; circulating damp heat: 25℃ ~55℃, 24h

70℃ durability

（70±2）℃，U_Rperhaps U_max(Small ones), 1000h

Steady state damp heat

（40±2）℃，RH （93±3）%，56d

Upper limit class temperature durability

U=0，125℃，1000h

RJ16

1

1~10M

±0.5

±1

±2

±5

500

500

±250

RJ17

2

750

750

withstand voltage

No breakdown or flying arc

V-block method, RJ 16-500V and RJ 17-750V, 1min

solderability

The solder flows freely and the lead wetting is well soldable

（265±5）℃，（2±0.5）s

overload

∆R≤±（0.5%R+0.05Ω ）

2.5U_R(Or 2U_max) Take the smaller one, 15s

Lead-end strength

∆R≤±（0.5%R+0.05Ω ）

Tension: 10N, bending: 2 times, torsion: 180°, 2 times

Welding heat resistance

∆R≤±（0.5%R+0.05Ω ）

（260±5）℃，（10±1）s ，（2~2.5）mm

vibrate

∆R≤±（0.5%R+0.05Ω ）

(10~500) Hz, 0.75mm (or 98m / s²) The smaller ones, 6h

The temperature changes rapidly

∆R≤±（0.5%R+0.05Ω ）

(-55~125) ℃, 5 cycles

The order of climate

∆R≤±（2%R+0.10Ω ），R_I≥100MΩ

Article 4.23 in GB / T 5729-2003

Steady state damp heat

∆R≤±（2%R+0.10Ω ），R_I≥100MΩ

（40±2）℃，RH （90~95）%，56d

durability

∆R≤±（2%R+0.10Ω ），R_I≥1GΩ

（70±2）℃，U_R(perhaps U_max) For the smaller ones, 1,000 h

Upper limit class temperature durability

∆R≤±（2%R+0.10Ω ），R_I≥1GΩ

U=0，125℃，1000h

RJ20

0.25

0.1~390k

0.1Ω~4.7Ω ：±5

4.7Ω~390kΩ ：±1、±2、±5

250

250

±250

±500

RJ20

0.5

350

500

RJ19

RJ20

1

RJ20：0.1~390k

RJ19：4.7~390k

RJ20：0.1Ω~4.7Ω ：±5

5.1Ω~390kΩ ：±1、±2、±5

RJ19：±0.5、±1、±2、±5

350

500

RJ20：±250±500

RJ19：±50±100

2

350

500

3

RJ20：1~220k

RJ19：4.7~390k

500

700

withstand voltage

No breakdown or flying arc

V-block method, 1min, the applied voltage is shown in the table above

solderability

90%

（235±5）℃，（2±0.5）s

The temperature changes rapidly

RJ19：∆R≤±（0.25%R+0.05Ω ）

RJ20：∆R≤±（1%R+0.05Ω ）

RJ 19: (-55~125) ℃, 5 cycles; RJ 20: (-55~155) ℃, 5 cycles

overload

2.5U_ROr 2U_max(Small ones), 5s

Lead-end strength

Tension: 10N, bending: 2 times, torsion: 180°, 2 times

Welding heat resistance

（350±10）℃，（3.5±0.5）s

vibrate

10 Hz to 500 Hz, 0.75mm or 98m / s²(Small ones), 6h

electrical endurance

RJ19：∆R≤±（1%R+0.05Ω ）

RJ20：∆R≤±（5%R+0.05Ω ）

（70±2）℃，U_Rperhaps U_max(Small ones), 1000h

Steady state damp heat

（40±2）℃，RH （90~95）%，56d

Upper limit class temperature durability

U=0，RJ19：125℃，RJ20：155℃，1000h

The order of climate

High temperature: RJ 19:125℃, RJ 20:155℃, 16h; circulating damp and heat: 25℃ ~55℃, 24h; low temperature: -55℃, 2h; low pressure: 8.5 Kpa, 15℃ ~35℃, 1h; circulating damp and heat: 25℃ ~55℃, 24h

fire resistance

The burning time away from the flame is less than 10s

Flame method, 15s, 5 times

RJ23A

0.167

4.7~2M

±0.1

±0.25

±0.5

±1

200

250

±25

±50

RJ24A

0.25

4.7~2.2M

250

350

RJ25A

0.5

4.7~3.3M

350

500

withstand voltage

No breakdown or flying arc

V-block method, 1min, the applied voltage is shown in the table above

solderability

95%

（235±5）℃，（5±0.5）s

The temperature changes rapidly

∆R≤±（0.25%R+0.05Ω ）

(-55~125) ℃, 5 cycles

overload

2.5U_ROr 2U_max(Small ones), 5s

Lead-end strength

Tension force: 5N (RJ23A) / 10N (other), bend: 2, twist: 180°, 2

Welding heat resistance

（260±5）℃，（10±1）s

The order of climate

∆R≤±（1%R+0.1Ω ）

High temperature: 125℃, 16h; circulating damp heat: 25℃ ~55℃, 24h; low temperature: -55℃, 2h; low pressure: 8.5 Kpa, 15℃ ~35℃, 1h; circulating damp heat: 25℃ ~55℃, 24h

70℃ durability

（70±2）℃，U_Rperhaps U_max(Small ones), 1000h

vibrate

∆R≤±（0.25%R+0.05Ω ）

(10~500) Hz, 0.75mm or 98m / s²(Small ones), 6h

Steady state damp heat

∆R≤±（1%R+0.1Ω ）

（40±2）℃，RH （90~95）%，56d

Upper limit class temperature durability

U=0，125℃，1000h